A micromechanical model of a hard interface with micro-cracking damage

Bonding techniques are increasingly used in many industrial fields. Modeling the under-load damaging behavior of hard structural adhesives is still an open challenge. This work proposes a new interface analytical model with evolutive micro-cracking damage. The obtained within rigorous theoretical framework combining asymptotic theory and micromechanical homogenization. Main features are: (i) adoption two dual homogenization approaches; (ii) formulation thermodynamically-based damage evolution law for interfaces. able to describe both ductile brittle adhesives. Provided examples on behavior, under several loads, suggest suitability proposed as modeling strategy